NETZSCH Thermal Analysis Products and Services

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Guarded Heat Flow Meter

NETZSCH guarded heat flow meters permit testing of materials of moderate thermal conductivity such as plastics, epoxies and glass. All models test solid and thin sheet materials. Optional cells are available for testing pastes, powders and polymers through the melt.

All models conform to ASTM F433 and E1530
Small sample size
Sub-ambient testing optional
Optional PC interface

Principle of operation

The user measures the thickness of the test sample and places it between two heated plates controlled at different temperatures. Thermocouples just below the plate surfaces measure the temperature drop across the sample. A heat flux transducer mounted on the cold plate measures a voltage which is proportional to the heat flow through the sample. Steady thermocouple and transducer readings indicate thermal equilibrium. Readings are recorded and the instrument is ready to begin a test at a new temperature.

The instrument is calibrated with materials of known thermal conductivity. This establishes a relation between the voltage signal of the transducer and the heat flow through it. Thermal conductivity is calculated from the calibration data, the sample thickness and the temperature drop across the sample.

Technical specifications

	TCA-446/1/m	TCA-446/1	TCA-446/2	TCA-446/3
Sample Size	50 mm dia x 0.1 to 20 mm thick
Thermal Conductivity Range	0.1 to 10 W/mK
Mean Sample Temperature range	40 to 200 ¡C	-150 to 200 ¡C	-150 to 250¡C	40 to 300¡C
Accuracy Rs=0.005-0.05 m²K/W Rs=0.002-0.005 m²K/W	+ / - 4 % + / - 5 to 10%
Dimensions L x W x H	50 x 60 x 25 cm³	55 x 65 x 100 cm³	55 x 65 x 100 cm³	25x 60 x 45 cm³

NETZSCH offers instruments for thermal analysis, thermal properties measurement, thermal hazard screening, and contract testing services. Our portfolio is the world's broadest, including a full range of dilatometers to measure high accuracy thermal expansion, classical DSC & TGA, high temperature DSC to 1650°C for specific heat, very high temperature STA (TGA-DSC/DTA) from sub-ambient to 2400°, thermal / evolved gas analysis with fully-integrated FTIR & MS, high resolution TMA and DMA, plus DEA - dielectric analysis for thermoset cure monitoring. We also feature leading-edge technology for thermal conductivity by guarded hot plate and heat flow meters, laser flash thermal diffusivity measurement, thermal hazard screening via adiabatic reaction calorimetry, as well as refractories testing including HMOR, CIC, and RUL. Finally, we offer advanced software packages including thermokinetics for process modeling and development.

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